๐Ÿ“… 01 July 2020
DOI: 10.51903/elkom.v13i1.11

Simulation of The Temperature Profile of The Curing Process of Thick Carbon Fiber Laminates Using The Age Algorithm

Jurnal Elektronika dan Komputer
Universitas Sains dan Teknologi Komputer

๐Ÿ“„ Abstract

This paper determines by simulation the temperature profiles of a thick carbon fiber/epoxy laminate during its cure process. The one-dimensional model of heat transfer is solved by using a finite difference numerical scheme. In the process, the same physical and thermal properties of materials used by ZhanSheng et al. are employed. The temperature is calculated through a judicious formulation and application of the Alternating Group Explicit (AGE) iterative method developed by Evans and Sahimi. A fourthorder Runge Kutta method is applied for the cure. The AGE scheme proves to be a viable iterative method with respect to stability, efficiency and rate of convergence.

๐Ÿ”– Keywords

#programming #problems #material #system

โ„น๏ธ Informasi Publikasi

Tanggal Publikasi
01 July 2020
Volume / Nomor / Tahun
Volume 13, Nomor 1, Tahun 2020

๐Ÿ“ HOW TO CITE

Amna Amna; Ahmad Kamal bin Zulkifle; Norma Alias; Norhalena Mohd. Nor; Noreliza Abu Mansor; Ishak Hashim, "Simulation of The Temperature Profile of The Curing Process of Thick Carbon Fiber Laminates Using The Age Algorithm," Jurnal Elektronika dan Komputer, vol. 13, no. 1, Jul. 2020.

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